COST FOR VIA IN PAD
SEC has been a leader in via-in-pad technology since 2002. During this time, we have identified and addressed the most common root causes for yield loss.
VOIDS / DIMPLES
Through the use of vacuum tables and power squeegees, we have been able to fill up to 10:1 aspect ratio vias with no voiding.
Many of our competitors produce via-in-pad too intermittently to invest in the specialized equipment necessary to planarized via-in-pad PCBs with sufficient throughput and quality suitable for PCB assembly.
We have purchased and installed a Pola & Massa conveyorized planarizer that utilizes ceramic scrubbing rollers to ensure a high grade surface finish for via-in-pad applications.